Guide: Document provides overview of board flexure control methodology, board preparation, Intel(r) BFI metrics, component determinations, with motherboard assembly line strain measurement, flexure reductions, test planning, and general procedures.
Chen Han Lim demos a solution that collects machine data in a mobile app for manufacturing efficiency.
Guide to LGA1567 socket independent loading mechanism installation for minimized contact damage.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Step-by-step instructions for aligning Intel® motherboards and the I/O opening on a computer chassis.
Processor insertion guide for LGA115X socket independent loading mechanism, minimizing contact damage.
Intel’s ESD prevention methods prevent costly damage to electronic devices.